cystech electronics corp. spec. no. : c463j3 issued date : 2010.06.30 revised date : 2012.07.30 page no. : 1/8 MBR05100AJ3 cystek product specification 5amp. schottky barrier rectifiers MBR05100AJ3 features ? 175 operating junction temperature ? low v f and low i r type ? metal silicon junction, major carrier conduction ? guardring for over voltage protection ? low power loss, high efficiency ? high surge capability ? for use in low voltage, high frequency inverters, free wheeling, and polarit y protection application ? pb-free lead plating an d halogen-free package mechanical data ? case: to-252 molded plastic ? mounting position: any ? weight: 0.34 grams approximately ? terminals: pure tin plated, lead-fre e, solderable per mil-std-750 method 2026 ? epoxy: ul 94v-0 rate flame retardant ? polarity : indicated by diode symbol equivalent circuit outline to-252ab to-252aa MBR05100AJ3 i f(av) 5a v rrm 100v tj 175 c v f(typ.) 0.65v a k a a k a
cystech electronics corp. spec. no. : c463j3 issued date : 2010.06.30 revised date : 2012.07.30 page no. : 2/8 MBR05100AJ3 cystek product specification maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 100 v maximum rms voltage v rms 70 v maximum dc blocking voltage v dc 100 v i f =5a, t c =25 0.85 i f =5a, t c =125 0.65 0.70 i f =10 a, t c =25 0.92 maximum instantaneous forward voltage at (note 1) i f =10a, t c =125 v f 0.80 v maximum average forward rectified current @ t c =133 i f(av) 5 a peak repetitive forward current (square wave, 20khz, t c =133 ) i frm 10 a non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 110 a peak repetitive reverse surge current (note 1 ), t j <175 i rrm 2.5 a v r =100 v, t c =25 5 a maximum instantaneous reverse current at v r =100 v, t c =125 i r 5 ma voltage rate of change, (rated v r ) dv/dt 10,000 v/ s typical junction capacitance @ f=1mhz and applied 5v reverse voltage c j 105 pf esd susceptibility (note 2) 8000 v storage temperature range t stg -65 +175 operating junction temperature range t j -65 +175 notes : 1. 2.0 s pulse width, f=1.0khz 2. human body model, 1.5k in series with 100pf thermal data parameter symbol value unit maximum thermal resistance, junction-to-case r th,j-c 2.5 c/w maximum thermal resistance, junction-to-ambient r th,j-a 125 c/w ordering information device package shipping MBR05100AJ3 to-252 (pb-free lead plating an d halogen-free package) 2500 pcs / tape & reel
cystech electronics corp. spec. no. : c463j3 issued date : 2010.06.30 revised date : 2012.07.30 page no. : 3/8 MBR05100AJ3 cystek product specification typical characteristics forward current derating curve 0 1 2 3 4 5 6 0 25 50 75 100 125 150 175 200 case temperature---t c () average forward current---i f(av) (a) resistive or inductive load per leg forward current vs forward voltage 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=150 per leg reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 0 20406080100120 reverse voltage---v r (v) reverse leakage current---i r (a) tj=75 tj=25 tj=125 per leg junction capacitance vs reverse voltage 10 100 1000 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz per leg
cystech electronics corp. spec. no. : c463j3 issued date : 2010.06.30 revised date : 2012.07.30 page no. : 4/8 MBR05100AJ3 cystek product specification recommended soldering footprint
cystech electronics corp. spec. no. : c463j3 issued date : 2010.06.30 revised date : 2012.07.30 page no. : 5/8 MBR05100AJ3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c463j3 issued date : 2010.06.30 revised date : 2012.07.30 page no. : 6/8 MBR05100AJ3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
cystech electronics corp. spec. no. : c463j3 issued date : 2010.06.30 revised date : 2012.07.30 page no. : 7/8 MBR05100AJ3 cystek product specification to-252ab dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.087 0.094 2.200 2.400 e 0.213 0.224 5.400 5.700 a1 0.000 0.005 0.000 0.127 e *0.091 *2.300 b 0.053 0.065 1.350 1.650 e1 0.177 0.185 4.500 4.700 b 0.020 0.028 0.500 0.700 l 0.374 0.390 9.500 9.900 b1 0.028 0.035 0.700 0.900 l1 0. 100 0.114 2.550 2.900 c 0.017 0.023 0.430 0.580 l2 0.055 0.070 1.400 1.780 c1 0.017 0.023 0.430 0.580 l3 0.014 0.026 0.350 0.650 d 0.250 0.262 6.350 6.650 v 0. 150 ref 3.800 ref d1 0.205 0.213 5.200 5.400 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead : pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 marking: style: pin 1.anode 2.cathode 3.anode 3-lead to-252ab plastic surface mount package cystek package code: j3 cys 05100a
cystech electronics corp. spec. no. : c463j3 issued date : 2010.06.30 revised date : 2012.07.30 page no. : 8/8 MBR05100AJ3 cystek product specification to-252aa dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.087 0.094 2.200 2.400 e 0.086 0.094 2.186 2.386 a1 0.000 0.005 0.000 0.127 e1 0.172 0.188 4.372 4.772 b 0.039 0.048 0.990 1.210 h 0.163 ref 4.140 ref b 0.026 0.034 0.660 0.860 k 0.190 ref 4.830 ref b1 0.026 0.034 0.660 0.860 l 0.386 0.409 9.800 10.400 c 0.018 0.023 0.460 0.580 l1 0.114 ref 2.900 ref c1 0.018 0.023 0.460 0.580 l2 0.055 0.067 1.400 1.700 d 0.256 0.264 6.500 6.700 l3 0.024 0.039 0.600 1.000 d1 0.201 0.215 5.100 5.460 p 0.030 ref 0.750 ref e 0.236 0.244 6.000 6.200 v 0.211 ref 5.350 ref notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead : pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . marking: style: pin 1.anode 2.cathode 3.anode 3-lead to-252aa plastic surface mount package cystek package code: j3 cys 05100a
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